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Intel Core i9 13900KF
3 GHz - 24 Kerne - 32 Threads - 36 MB Cache-Speicher - LGA1700 Socket
Intel Core i9 13900KF - 3 GHz - 24 Kerne - 32 Threads - 36 MB Cache-Speicher - LGA1700 Socket - Box
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| Artikelnummer: | CPIN258 |
| Herstellernummer: | BX8071513900KF |
| EAN Code: | 5032037258623 |
| Versandgewicht: | 0.1 kg |
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Hauptmerkmale |
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| Produktbeschreibung: | Intel Core i9 13900KF / 3 GHz Prozessor - Box |
| Produkttyp: | Prozessor |
| Prozessortyp: | Intel Core i9 13900KF (13th Gen) |
| Anz. der Kerne: | 24 Kerne / 32 Threads |
| Cache-Speicher: | 36 MB |
| Geeignete Sockel: | LGA1700 Socket |
| Prozessoranz.: | 1 |
| Taktfrequenz: | 3 GHz (P-Kern) / 2.2 GHz (E-Kern) |
| Max. Turbo-Taktfrequenz: | 5.8 GHz (P-Kern) / 4.3 GHz (E-Kern) |
| Herstellungsprozess: | 10 nm |
| Funktionen: | Enhanced SpeedStep technology, Hyper-Threading-Technologie, Unterstützung für Execute Disable Bit, Intel Virtualization Technology, Intel 64 Technology, Streaming-SIMD-Erweiterungen 4.1, Streaming-SIMD-Erweiterungen 4.2, Intel Turbo Boost Technology 2.0, Intel AES New Instructions (AES-NI), Thermal Monitoring Technologies, Intel Virtualization Technology for Directed I/O (VT-d), Idle States, Intel VT-x with Extended Page Tables (EPT), Intel Secure Key, Intel Advanced Vector Extensions 2 (AVX2.0), Intel OS Guard, Intel Turbo Boost Max Technology 3.0, Intel Speed Shift Technology, Mode-based Execute Control (MBE), Intel Volume Management Device (VMD), Intel Boot Guard, Intel Thermal Velocity Boost, Intel Deep Learning Boost (DL Boost), Intel Control-Flow Enforcement Technology, Intel Gaussian and Neural Accelerator 3.0, Intel Thread Director, Instruction Set 64-bit, Intel Standard Manageability (ISM) |
Allgemein |
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| Hersteller: | Intel |
| Herst.Art.Nr.: | BX8071513900KF |
| EAN: | 5032037258623 |
| Produkttyp: | Prozessor |
| Prozessor | |
| Typ / Formfaktor: | Intel Core i9 13900KF (13th Gen) |
| Anz. der Kerne: | 24 Kerne |
| Anz. der Threads: | 32 Threads |
| Cache-Speicher: | 36 MB |
| Cache-Speicher-Details: | Smart Cache - 36 MB |
| Prozessoranz.: | 1 |
| Taktfrequenz: | 3 GHz (P-Kern) / 2.2 GHz (E-Kern) |
| Max. Turbo-Taktfrequenz: | 5.8 GHz (P-Kern) / 4.3 GHz (E-Kern) |
| Geeignete Sockel: | LGA1700 Socket |
| Herstellungsprozess: | 10 nm |
| Thermal Design Power (TDP): | 253 W |
| Temperaturspezifikationen: | 100 °C |
| PCI Express Revision: | 4.0/5.0 |
| PCI Express-Konfigurationen: | 1x16+4, 2x8+4 |
| Anz. PCI Express Lanes: | 20 |
| Architektur-Merkmale: | Enhanced SpeedStep technology, Hyper-Threading-Technologie, Unterstützung für Execute Disable Bit, Intel Virtualization Technology, Intel 64 Technology, Streaming-SIMD-Erweiterungen 4.1, Streaming-SIMD-Erweiterungen 4.2, Intel Turbo Boost Technology 2.0, Intel AES New Instructions (AES-NI), Thermal Monitoring Technologies, Intel Virtualization Technology for Directed I/O (VT-d), Idle States, Intel VT-x with Extended Page Tables (EPT), Intel Secure Key, Intel Advanced Vector Extensions 2 (AVX2.0), Intel OS Guard, Intel Turbo Boost Max Technology 3.0, Intel Speed Shift Technology, Mode-based Execute Control (MBE), Intel Volume Management Device (VMD), Intel Boot Guard, Intel Thermal Velocity Boost, Intel Deep Learning Boost (DL Boost), Intel Control-Flow Enforcement Technology, Intel Gaussian and Neural Accelerator 3.0, Intel Thread Director, Instruction Set 64-bit, Intel Standard Manageability (ISM) |
| Verschiedenes | |
| Verpackung: | Intel Boxed |
